Epoxy Moulding Compound Supplier in Malaysia
- Also known as
- Epoxy Molding Compound
- Semiconductor Moulding Compound
Epoxy moulding compound is supplied for semiconductor encapsulation and qualified electronic-package production in Malaysia. It is a filled thermosetting compound engineered for transfer moulding around dies, leadframes, wire bonds and related package structures, rather than a general liquid epoxy resin.
Commercial programmes may require standard encapsulation, low-stress, low-warpage or higher-thermal-performance grades in granular, pelletised or tablet form. Grade selection depends on mould flow, cure profile, adhesion, package geometry, moisture performance and the reliability tests applied to the finished device.
Typical applications include integrated circuits, discrete components, sensors, power devices and advanced package formats. Buyers should identify the package design and processing window because materials that look similar can differ materially in filler loading, flow behaviour and qualification performance.
Send the package type, moulding process, target properties, qualification requirements, quantity and delivery location with your enquiry. Availability, packing, documentation and delivery timing are confirmed for the selected epoxy moulding compound grade.
- Grade
- semiconductor encapsulation, low-stress, low-warpage, high-thermal-performance
- Appearance
- black or dark granular, pelletised or tablet-form compound
Epoxy Moulding Compound grades and forms
We supply several forms to suit different formulating and dosing setups. If you need a size that is not listed, ask us.
| Grade | Form | Assay | Typical use | Packing |
|---|---|---|---|---|
| General semiconductor encapsulation grade | granules, pellets or tablets | — | Transfer moulding and encapsulation of integrated circuits, discrete devices and established semiconductor packages | Confirmed with the quotation |
| Low-stress and low-warpage grade | granules, pellets or tablets | — | Packages requiring controlled moulding stress, dimensional stability and reduced package deformation | Confirmed with the quotation |
| High-thermal-performance grade | granules, pellets or tablets | — | Power devices and electronic packages with defined thermal, reliability and processing requirements | Confirmed with the quotation |
How to buy epoxy moulding compound from ChemTrade
Request a quote for epoxy moulding compound
Use the form below to request a quotation. You can also email sales@chemtrademalaysia.com or send us a message on WhatsApp.
Specifications
| Parameter | Value | Method |
|---|---|---|
| Product type | Filled thermosetting epoxy compound | — |
| Commercial form | Granules, pellets or tablets | — |
| Processing route | Heat-cured semiconductor transfer moulding | — |
Epoxy Moulding Compound applications
Safety and handling
Keep sealed, dry and protected from heat, moisture and contamination under the storage conditions stated for the selected grade.
Common questions about epoxy moulding compound
What information is needed to select an epoxy moulding compound?
Provide the semiconductor package type, moulding equipment, target flow and cure conditions, reliability tests, colour requirement and any incumbent-grade reference available for matching.
Is epoxy moulding compound the same as general epoxy resin?
No. Epoxy moulding compound is a formulated, filled thermosetting material for electronic encapsulation, while epoxy resin is a base raw material used in many different systems.
Which grades help control package stress and warpage?
Low-stress or low-warpage grades are selected against package geometry, filler system, moulding conditions and reliability targets. State the measured limits and test conditions with the enquiry.
Can epoxy moulding compound be considered for power semiconductor packages?
Grades are available for different thermal and reliability requirements, but selection must be matched to the device design, operating conditions, moulding process and qualification programme.
How is epoxy moulding compound packing confirmed?
Pack format, storage conditions, shelf-life documentation and handling requirements are confirmed for the quoted grade rather than assumed from the general product name.