Chemicals for Electronics & Metal Finishing in Malaysia
ChemTrade supplies 140 products into electronics & metal finishing in Malaysia. Each listing carries typical specifications, packing and availability.
| Product | Used for |
|---|---|
| 2-Ethoxyethanol | Photoresist stripping, rinse and precision cleaning steps in electronics and metal finishing, against an electronic-grade specification the buyer defines. |
| 2-Ethoxyethyl Acetate | Higher-purity grades for photoresist processing and cleaning formulations where the buyer specifies impurity limits. |
| Acetonitrile | Electrolyte and formulation solvent in selected battery and capacitor chemistry, where a wide liquid range and high dielectric constant are the properties being bought. |
| Activated Carbon | Supporting ultrapure and process-water polishing steps where residual organics and taste or odour contaminants must stay low. |
| Aluminium Nitrate | Thin-film and surface chemistry, corrosion-inhibition work and metal finishing baths that specify aluminium nitrate with controlled chloride levels. |
| Aluminium Oxide | Technical ceramic substrates, insulators and wear parts, and the final polishing of metal and glass surfaces. |
| Ammonium Bifluoride | Metal surface treatment, aluminium cleaning and finishing formulations where a bifluoride salt is specified for oxide or scale control. |
| Ammonium Chloride | Electrolyte in zinc-carbon dry cells and related battery chemistry, and a process salt in soldering and tinning flux manufacture. |
| Ammonium Hydroxide | Metal surface treatment, cleaning and process baths in finishing lines that call for ammonium hydroxide or aqueous ammonia. |
| Ammonium Oxalate | Metal surface treatment, electroplating pretreatment and metal cleaning formulations where an oxalate salt is used in place of a free acid. |
| Ammonium Persulfate | Copper etchant and micro-etch for printed circuit boards, plus surface cleaning and oxide removal on copper before plating or lamination. |
| Ammonium Thiocyanate | Metal treatment, pickling and surface-finishing baths, and electroplating make-up that specifies a thiocyanate salt in the working solution. |
| ATMP | Formulation component for selected metal surface-treatment and electroplating processes. |
| Barium Carbonate | Ferrite and electronic ceramic production where higher-purity grades may be specified for dielectric, magnetic or related ceramic formulations. |
| Barium Nitrate | Electronic and dielectric ceramic compositions where higher-purity barium nitrate is specified and strontium or halide limits are written into the incoming material specification. |
| Benzotriazole | Copper surface protection in electroplating baths and printed circuit board manufacture, including post-etch treatment and storage protection of exposed copper. |
| Borax | Flux and process ingredient in metalworking, brazing, soldering and selected surface-treatment operations. |
| Boric Acid | Buffering and brightening additive in nickel and zinc electroplating baths and related surface-treatment chemistry. |
| Brominated Flame Retardant | Used in selected wire and cable compounds and electrical or electronic enclosures according to the required polymer system and flammability rating. |
| Butyl Diglycol Acetate | Cleaning and rinse formulations for boards, tooling and precision parts that rely on a high-boiling ester with a low residue after drying. |
| Cadmium Acetate | Electrolyte and metal-finishing formulations where cadmium acetate is the specified cadmium salt. |
| Carbon Black | Conductive and antistatic compounds, cable screening and conductive coatings, where the loading is set by a target resistivity. |
| Cerium Oxide | Abrasive component in chemical-mechanical polishing (CMP) slurries for semiconductor wafers, display glass and related precision surface finishing. |
| Chlorinated Polyethylene | Elastomer grades are used in wire and cable jacketing compounds where the polymer properties suit the cable formulation. |
| Chromium Sulphate | Chromium(III) sulphate grades are used in metal-finishing and chrome-plating solution preparation. |
| Cobalt Nitrate | Used in selected cathode-material precursor processes, electroplating and electroless plating formulations. |
| Cobalt Sulphate | Cobalt source for electroplating and surface-finishing baths, including cobalt-alloy deposits, with the grade selected against bath assay and impurity limits. |
| Copper Chloride | Cupric chloride etchant for printed circuit board manufacture and metal photo-etching, where the copper(II) ion dissolves copper and the bath is regenerated by oxidation rather than discarded. |
| Copper EDTA | Soluble copper chelate for selected electroplating and electroless-plating bath formulations. |
| Copper Pyrophosphate | Copper source for alkaline non-cyanide pyrophosphate plating baths, including printed circuit board through-hole and metal-finishing work. |
| Copper Sulphate | Copper ion source in acid copper electroplating and electroforming baths, with the chemical grade selected against the bath specification. |
| Cream of Tartar | Technical use in metal cleaning and electroplating baths where potassium bitartrate is specified as a process salt rather than tartaric acid. |
| Cuprous Oxide | Semiconductor and rectifier material, and a precursor in thin-film and photocatalyst work where the copper(I) state is the point of using it. |
| Dicumyl Peroxide | Crosslinking aid in selected cable insulation and polymer compounds used in electrical applications, subject to the grade and process specification. |
| Dimethyl Sulfoxide | Process solvent for semiconductor and display cleaning, photoresist stripping and related electronics manufacturing steps that call for DMSO. |
| Dimethylformamide | Process solvent in selected semiconductor, capacitor and electronics manufacturing operations that specify dimethylformamide. |
| Dipropylene Glycol Dimethyl Ether | Considered for electronics and precision-cleaning formulations where solvent profile and water content are tightly specified. |
| Dipropylene Glycol Methyl Ether | Used in electronics cleaning formulations. |
| Distilled Water | Selected rinsing and process steps that call for distilled water. Confirm conductivity and impurity limits, because some electronics specifications require a different purified-water grade. |
| DTPA | Used in selected electroplating and photographic chemistry formulations as a metal-ion chelating agent. |
| Epoxy Resin | Electrical laminates, potting, encapsulation and related insulation systems where an industrial epoxy resin is formulated with a matching hardener or curing agent. |
| Ethoxypropanol | Solvent option for formulated electronics and precision-cleaning processes where the selected specification is suitable. |
| Ethyl 3-Ethoxypropionate | Photoresist, edge-bead removal and precision cleaning steps in electronics and metal finishing, using an electronic-grade specification defined by the process. |
| Ethyl Lactate | Photoresist solvent, edge-bead removal and precision cleaning in electronics and metal finishing, using an electronic-grade specification with defined metal and particle limits. |
| Ferric Chloride | Standard aqueous etchant for copper printed circuit boards and for photo-etching of selected metal parts where ferric chloride is specified. |
| Ferric Nitrate | Metal surface treatment, etching and related finishing baths that call for ferric nitrate as the iron(III) and nitrate component. |
| Fluoroboric Acid | Fluoroboric acid is used in fluoroborate electroplating baths and in electronics and PCB surface-finishing processes. |
| Gamma Butyrolactone | Electronic-grade solvent for cleaning, photoresist stripping, capacitor electrolytes and related electronics process steps that specify GBL. |
| Gluconic Acid | Metal-surface cleaning and finishing solutions that specify free gluconic acid for chelation during selected electronics or metal-finishing steps. |
| Glycidoxypropyltrimethoxysilane | Considered for compatible electronic encapsulant and surface-treatment formulations requiring an epoxy-functional silane. |
| Graphite | Conductive fillers, battery-related compounds and carbon brush or contact materials where controlled graphite grade and particle size matter. |
| Gum Rosin | Natural resin feedstock for soldering and metalworking flux bases; finished flux blends remain a separate product enquiry when required. |
| Hydrofluoric Acid | Metal cleaning, pickling and stainless-steel surface treatment, plus electronics and semiconductor cleaning steps that call for aqueous HF at a stated concentration and purity. |
| Hydrofluorosilicic Acid | Used in selected metal surface-treatment, electroplating, aluminium and steel processing formulations. |
| Hydroxylamine Sulphate | Photographic, imaging and metal-surface treatment processes that call for hydroxylamine sulphate. |
| Hypophosphorous Acid | Free-acid hypophosphorous chemistry for electroless nickel bath make-up and related metal-finishing systems that specify the acid rather than a hypophosphite salt. |
| Ion Exchange Resin | Ultrapure water systems for semiconductor and printed circuit work, and rinse water recovery on plating and metal finishing lines. |
| Isobutanol | Cleaning and rinsing solvent in metal finishing and component preparation where an alcohol of this evaporation rate is specified. |
| Isoparaffin Solvent | Precision and electronics cleaning and metal degreasing where a low-odour, narrow-cut hydrocarbon solvent is specified. |
| Isopropyl Acetate | Precision and assembly cleaning with the higher-purity grade, chosen for low residue on the cleaned surface and a short drying interval. |
| Isopropyl Alcohol | Cleaning and rinsing compatible circuit boards, components, connectors and tooling where the selected grade meets the required limits for water, residue and trace contaminants. |
| Lithium Carbonate | High-purity feedstock for lithium-ion battery cathode precursors and related energy-storage material manufacture when battery-grade material is specified. |
| Lithium Hydroxide | Cathode and battery precursor supply for lithium-ion materials, and alkaline battery electrolyte work, where carbonate and metallic impurity limits drive the grade selection. |
| Malic Acid | Chelating and metal-cleaning aid in selected technical cleaning solutions where organic acid performance is specified. |
| Manganese Carbonate | Soft ferrite powders, thermistors and dielectric ceramics, where the carbonate calcines cleanly to the oxide and low iron and alkali levels matter to the fired properties. |
| Manganese Dioxide | Cathode and depolariser powder in zinc-carbon and alkaline dry cells, with electrolytic grades selected where high-drain cell performance depends on MnO2 purity and crystal form. |
| Manganese Sulphate | High-purity manganese sulphate for battery precursor routes and related electronic materials when the buyer states the purity and impurity limits. |
| Mercury | Discharge and fluorescent lamps, and switches and relays where they remain permitted. |
| Methanesulfonic Acid | Process acid in selected electronics and printed-circuit metal-finishing steps that call for MSA solutions or high-purity grades with controlled impurities. |
| Methyl Amyl Ketone | Selected photoresist handling, thinning and precision cleaning steps where an electronic-grade 2-heptanone specification is called for by the process. |
| Methylene Chloride | Cold degreasing and cleaning of metal parts, components and assemblies where a volatile chlorinated solvent is specified. |
| Monocalcium Phosphate | Acidic phosphate component in metal-pretreatment and surface-conditioning chemistry, where the coating bath is built around soluble phosphate. |
| Monosodium Phosphate | Phosphating and metal-pretreatment baths, pickling and surface-conditioning chemistry, where a soluble acidic phosphate feeds the conversion coating. |
| N-Heptane | Used in precision and electronics cleaning processes that specify n-heptane and a suitable purity grade. |
| N-Methyl-2-Pyrrolidone | Cleaning solvent, photoresist process medium and electronics manufacturing solvent where high-purity or electronic-grade NMP is required. |
| N-Octyl-2-Pyrrolidone | Used in metal and electronics cleaning formulations where the specified alkyl pyrrolidone is required. |
| N-Propanol | Precision cleaning and drying of components and assemblies where a low-residue alcohol of the required purity is needed. |
| Naphthenic Oil | Naphthenic base stock for transformer and electrical insulating oil blends when the specification calls for naphthenic rather than paraffinic feedstock. |
| Nickel Acetate | Mid-temperature sealing of anodised aluminium and bath make-up for electroplating or electroless nickel processes. |
| Nickel Carbonate | Nickel electroplating and electroless nickel lines use it for bath make-up and pH adjustment, since it neutralises free acid and replaces nickel without changing the anion balance of the bath. |
| Nickel Chloride | Chloride-ion source in Watts nickel, nickel strike and chloride-sulphamate plating baths, and in printed circuit and connector finishing lines running chloride-based nickel chemistry. |
| Nickel Nitrate | Nickel source for plating and metal-finishing process chemistry where a nitrate anion is specified, and for electronic materials work needing a soluble nickel salt of controlled purity. |
| Nickel Sulfamate | Used in nickel electroforming and in plating processes for printed circuits, lead frames, connectors and related electronic components. |
| Nickel Sulphate | Nickel ion source for nickel electroplating baths and electroless nickel process replenishment, with the grade selected against the bath assay and impurity limits. |
| Nitric Acid | Pickling, bright-dipping and passivation of stainless steel, copper and brass before plating or further finishing. |
| Nitrilotriacetic Acid | Used in metal cleaning, electroplating, surface treatment, electronics and photographic processing. |
| Ortho-Dichlorobenzene | Used in selected metal-processing and dielectric-fluid formulations subject to the buyer's technical specification. |
| Oxalic Acid | Used in controlled metal surface treatment and finishing formulations, including removal of iron oxides and process scale. |
| Phenol Sulphonic Acid | Used as the acid component in selected acid tin electroplating and tinplate electrolyte systems. |
| Phosphorus Oxychloride | Phosphorus dopant source in semiconductor and solar cell diffusion furnaces, where high-purity material with tight metal and moisture control is specified. |
| Polyphosphoric Acid | Metal treatment and rust-conversion formulations that call for a condensed phosphoric acid rather than orthophosphoric acid alone. |
| Potassium Cyanide | Cyanide-based electroplating and metal finishing applications that specify KCN for precious-metal and other controlled plating systems. |
| Potassium Dichromate | Oxidising or passivation component in selected metal-finishing formulations where potassium dichromate, rather than sodium dichromate, is specified. |
| Potassium Fluoride | Metal surface treatment and finishing formulations that call for KF in cleaning, etching or related surface-preparation steps on compatible substrates. |
| Potassium Hydroxide | Electrolyte component in alkaline batteries and process alkali in selected etching and cleaning baths. |
| Potassium Persulfate | Copper micro-etch and printed circuit board etching, plus oxide removal and surface cleaning before plating. |
| Potassium Sodium Tartrate | Used as an alkaline tartrate component in silver, copper and electroless plating baths, including mirror silvering processes. |
| Propylene Carbonate | High-purity propylene carbonate is used as a co-solvent in lithium-ion battery electrolytes and related energy-storage formulations where a high dielectric cyclic carbonate is specified. |
| Propylene Glycol Methyl Ether | Precision cleaning and rinsing of assemblies and components, plus photoresist-related processing steps that call for a high-purity glycol ether with controlled metal-ion content. |
| Propylene Glycol Methyl Ether Acetate | High-purity electronic-grade material is used as a photoresist solvent, thinner and edge-bead remover in semiconductor and related electronics manufacturing. |
| Propylene Glycol Propyl Ether | Formulation solvent for electronics-cleaning processes where water content, evaporation and residue requirements are specified. |
| Salicylic Acid | Component in selected metal-treatment and surface-chemistry processes where salicylic acid is specified as a process acid or complexing intermediate. |
| Silica Gel | Moisture control in component packs, assemblies and storage cabinets where humidity can cause corrosion, shorting or reliability failures. |
| Silicone Oil | Electrical insulating and dielectric fluid, and a release agent in electronic component moulding and potting. |
| Silver Chloride | Coating and pellet material for Ag/AgCl reference electrodes, pH and ion selective probes and thin-film sensor elements, where purity governs potential stability. |
| Silver Nitrate | Silver ion source for silver electroplating, silver-plated contacts, conductive inks and mirror silvering, with the grade matched to the bath or formulation specification. |
| Sodium 2-Ethylhexyl Sulfate | Used as a wetting component in selected electroplating and metal-finishing bath formulations. |
| Sodium Acid Pyrophosphate | Metal pretreatment and surface-conditioning baths that use an acidic pyrophosphate for cleaning and sequestration duties. |
| Sodium Bifluoride | Used in specified metal surface-treatment, pickling, aluminium anodising, electroplating and tin-plating processes. |
| Sodium Bisulphate | Acid salt for metal pickling, descaling and passivation lines and other finishing steps that call for a controlled acidic bath without handling concentrated acid. |
| Sodium Bromate | Used in selected electronics etching processes that specify sodium bromate as the oxidising component. |
| Sodium Cyanide | Cyanide electroplating baths for gold, silver, copper and cadmium, and salt baths for metal heat treatment. |
| Sodium Dimethyldithiocarbamate | Applied in treatment programmes for electroplating, metal-finishing, printed-circuit-board and electronics effluent containing dissolved metals. |
| Sodium Gluconate | Component of selected metal-treatment and electroplating baths where controlled chelation of metal ions supports bath stability. |
| Sodium Hydrosulfite | Reducing baths in photographic, imaging and metal-finishing work that specify a dithionite rather than an oxidising salt. |
| Sodium Hypophosphite | Reducing agent in electroless nickel plating baths, depositing a nickel-phosphorus coating without an applied current and supporting even thickness on complex geometries used in electronics and metal finishing. |
| Sodium Metasilicate | Degreasing and pre-treatment of steel and aluminium before plating, phosphating or painting, where the silicate strips oil and leaves a film that slows attack on the metal itself. |
| Sodium Perborate | Bath and surface treatment duty in electroplating and metal finishing where a mild solid oxidiser is specified. |
| Sodium Persulfate | Copper etchant and micro-etch on printed circuit boards, plus oxide stripping and surface roughening before plating or lamination. |
| Sodium Saccharin | Brightener and levelling additive in nickel electroplating baths, where saccharin is a long-established organic addition agent for deposit brightness and stress control in metal finishing. |
| Sodium Sesquicarbonate | Cleaning and light degreasing baths ahead of metal finishing, and rust or corrosion treatment work where a mild carbonate alkali is preferred to a hydroxide. |
| Sodium Thiocyanate | Electroplating and metal-finishing make-up where sodium thiocyanate is specified in the bath formulation. |
| Stannous Chloride | Tin(II) source for tin and tin-alloy plating baths and for the sensitising stage before electroless copper or nickel on plastics, boards and other non-conductive substrates. |
| Stannous Sulphate | Used in acid tin and tin-alloy electroplating baths for metal finishing and electronic component manufacture. |
| Succinic Acid | Component in selected metal pickling and electroplating bath chemistries where succinic acid is specified in the process recipe. |
| Sulphuric Acid | Metal pickling and surface preparation before plating, plus high-purity process use where a defined trace-metal specification is required. |
| Tannic Acid | Metal-treatment and rust-conversion formulations requiring a tannic-acid raw material matched to the process specification. |
| Tetrahydrofurfuryl Alcohol | Used as a solvent component in electronic-cleaning formulations where the required purity and water specification are defined. |
| Tetrasodium HEDP | Used in selected metal surface-treatment and cleaning formulations for metal-ion control. |
| Thiourea | Brightener and bath additive in electroplating and metal finishing lines, where thiourea is used to modify deposit appearance and plating behaviour. Also used in acid pickling systems as a corrosion inhibitor component. |
| Transformer Oil | Filling, topping up and refilling of power and distribution transformers, instrument transformers, reactors and rectifier equipment, where the oil insulates the windings and removes heat. |
| Trichloroethylene | Metal-parts and component cleaning in vapour degreasers and related precision cleaning steps where TCE solvent performance is specified. |
| Triethylene Glycol Monomethyl Ether | Used in industrial and electronics cleaning formulations that specify a water-miscible, high-boiling glycol ether. |
| Trimethylolpropane Triacrylate | Photoresists, electronics coatings and fibre optic coating formulations. |
| Vanadium Pentoxide | Electrolyte raw material for vanadium redox flow batteries, plus thin-film, photocatalyst and electronic-material work that needs a defined pentoxide. |
| Xylenol Orange | Used in plating-bath control and metal-finishing laboratory methods where xylenol orange is the specified reagent. |
| Zinc Chloride | Component of zinc ammonium chloride fluxes used before hot-dip galvanising, and of soldering and tinning flux formulations that help remove oxide films from metal surfaces. |
| Zinc EDTA | Metal-finishing and process solutions that need zinc held in a stable soluble complex rather than as a free ion. |
| Zinc Ingot | Bath make-up metal for hot-dip and general galvanising lines, and the base metal for zinc anodes used in electroplating and metal finishing. |
| Zinc Sulphate | Zinc ion source in selected electroplating baths and electrolyte make-up when the technical grade and impurity limits suit the process. |
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