Die Attach Film Supplier Malaysia
- Also known as
- DAF
- Die Attach Adhesive Film
Die attach film is a preformed adhesive material used to bond semiconductor dies during package assembly. ChemTrade accepts Malaysia enquiries for non-conductive, conductive and wafer-level DAF matched to an approved assembly process.
The film is selected by adhesive chemistry, thickness, release liner, cure profile and the required electrical or thermal path. Roll dimensions and lamination handling also matter because a qualified adhesive cannot be used efficiently if the supplied format does not fit the equipment.
Applications include single-die and stacked-die bonding, wafer lamination, module assembly and other microelectronic packaging operations. This page covers film products only and does not combine them with dispensed conductive adhesive, solder paste or general liquid epoxy.
Send the package design, substrate materials, film construction, dimensions, cure conditions and qualification quantity with the enquiry. Sample availability, documents, protective packing and delivery timing are confirmed with the quotation.
- Grade
- non-conductive, conductive, wafer-level
- Appearance
- thin adhesive film on a release liner
Die Attach Film grades and forms
We supply several forms to suit different formulating and dosing setups. If you need a size that is not listed, ask us.
| Grade | Form | Assay | Typical use | Packing |
|---|---|---|---|---|
| Non-conductive die attach film | adhesive film roll or sheet | — | Die bonding where electrical isolation, controlled bond-line thickness and clean handling are required. | Roll, sheet and liner format are confirmed for the assembly process. |
| Conductive die attach film | filled adhesive film | — | Packages that require an electrically or thermally conductive bond path through the die-attach layer. | Film width, length and protective packing are matched to the qualified material. |
| Wafer-level die attach film | lamination film | — | Wafer lamination and downstream singulation or package assembly using a process-qualified film construction. | Roll dimensions and release-liner configuration are agreed before quotation. |
How to buy die attach film from ChemTrade
Request a quote for die attach film
Use the form below to request a quotation. You can also email sales@chemtrademalaysia.com or send us a message on WhatsApp.
Specifications
| Parameter | Value | Method |
|---|---|---|
| Film construction | non-conductive, conductive or wafer-level grade | — |
| Thickness | matched to the qualified bond-line requirement | — |
| Cure profile | confirmed against the assembly process | — |
| Liner and roll format | specified for the lamination equipment | — |
| Electrical or thermal performance | declared for the selected grade | — |
Die Attach Film applications
Common questions about die attach film
What is die attach film used for?
Die attach film bonds a semiconductor die to a substrate or another die while maintaining a controlled adhesive layer. It is used in package assembly where film handling and repeatable bond-line thickness are preferred to dispensing a liquid adhesive.
Is die attach film the same as liquid die attach adhesive?
No. Die attach film is a preformed adhesive layer carried on a liner, while liquid or paste adhesive is dispensed during assembly. The equipment, placement method and cure window should be matched to the specified material form.
Should I request conductive or non-conductive DAF?
Choose according to whether the bond path must conduct electricity or heat, or remain electrically isolating. Send the package design and required performance because filler system, thickness and cure profile all affect the selection.
Which film dimensions must be included in an enquiry?
State the required thickness, film width, roll length or sheet size, liner type and any wafer-level lamination format. These details prevent a chemically suitable film from arriving in a form that does not fit the production equipment.
Can samples and qualification documents be requested?
Include the trial size, process conditions and document list with the enquiry. Sample availability, technical data, batch documentation and the commercial pack are confirmed for the candidate grade before supply.