CMP Slurry Supplier in Malaysia
- Also known as
- Chemical Mechanical Polishing Slurry
- Chemical Mechanical Planarization Slurry
- Chemical Mechanical Planarisation Slurry
CMP slurry supplier for semiconductor fabrication, wafer processing and precision polishing buyers in Malaysia. Chemical mechanical planarisation slurry is a formulated aqueous consumable that combines controlled abrasive particles with chemistry selected for a particular film stack and polishing objective.
Commercial families include silica-based oxide slurry, ceria slurry for selected oxide and shallow trench isolation steps, and metal CMP formulations for copper, tungsten or barrier materials. Particle size distribution, solids, pH, trace contamination, removal rate and selectivity are grade-specific qualification points.
A complete CMP slurry is different from loose cerium oxide, aluminium oxide or silica powder. The dispersed abrasive, oxidiser, inhibitor, complexing system and defect-control package must work together on the buyer's tool and substrate.
Send the film stack, target material, removal and selectivity requirements, tool, current reference grade, quantity and delivery location. Availability, clean packing, documentation and delivery timing are confirmed for the quoted CMP slurry.
- Grade
- silica based, ceria based, metal CMP
- Appearance
- aqueous colloidal suspension, typically white or translucent depending on abrasive system
CMP Slurry grades and forms
We supply several forms to suit different formulating and dosing setups. If you need a size that is not listed, ask us.
| Grade | Form | Assay | Typical use | Packing |
|---|---|---|---|---|
| Silica-based oxide CMP slurry | aqueous colloidal suspension | — | Planarisation and polishing of dielectric and oxide layers where colloidal silica particle properties and slurry chemistry are process-qualified. | Clean liquid packing is confirmed with the quotation. |
| Ceria-based CMP slurry | aqueous ceria suspension | — | Shallow trench isolation and selected oxide-polishing steps requiring the removal behaviour and selectivity associated with ceria abrasives. | Clean liquid packing is confirmed for the selected ceria grade. |
| Metal CMP slurry | formulated aqueous suspension | — | Copper, tungsten or other qualified metal planarisation processes using a matched abrasive, oxidiser, inhibitor and complexing system. | Pack format and handling conditions are confirmed for the process grade. |
How to buy CMP slurry from ChemTrade
Request a quote for CMP slurry
Use the form below to request a quotation. You can also email sales@chemtrademalaysia.com or send us a message on WhatsApp.
Specifications
| Parameter | Value | Method |
|---|---|---|
| Product type | formulated aqueous abrasive suspension for chemical mechanical planarisation | — |
| Abrasive system | colloidal silica, ceria, alumina or another process-qualified abrasive | — |
| Process controls | particle size distribution, solids, pH, removal rate and selectivity as specified | — |
| Contamination controls | metals, particles and ionic impurities matched to the wafer process requirement | — |
| Product boundary | complete slurry formulation, not dry polishing powder alone | — |
CMP Slurry applications
Safety and handling
Keep the slurry sealed and clean within the storage temperature stated for the quoted formulation. Protect it from contamination, evaporation, freezing and uncontrolled settling, and follow the grade's mixing instructions.
Common questions about CMP slurry
What is CMP slurry used for?
CMP slurry combines abrasive particles with controlled chemistry to remove and planarise wafer films during semiconductor fabrication. The formulation is matched to the film, underlying layer, tool and required selectivity.
Should I request silica-based or ceria-based CMP slurry?
Colloidal silica is common for many oxide and dielectric polishing steps, while ceria is selected for certain oxide and shallow trench isolation processes. The correct choice depends on removal rate, defects and selectivity.
Is cerium oxide powder the same as ceria CMP slurry?
No. Cerium oxide powder is an abrasive raw material, while a ceria CMP slurry is a formulated aqueous system with controlled particles, dispersion chemistry and process additives. Quote the complete slurry when the process needs it.
What information is needed to match a metal CMP slurry?
Provide the metal or barrier layer, underlying material, removal-rate and selectivity targets, defect limits, polishing tool and any approved reference formulation. Copper and tungsten processes generally require different chemistry.
How should CMP slurry packing be specified?
State the required pack volume, connection or dispensing arrangement, cleanliness expectations and consumption rate. The quotation confirms the clean pack offered and the handling conditions for that formulation.